PI膜 PI Film

GF
for FCCL, FPC

•Excellent Mechanical, Electrical Properties and

Dimensional Stability

•CTE Matched with Copper Foil

•TFT Substrates for Flexible Display (Yellow PI)

Insulating, Coating, Protecting & Matrix Materials

GD-A Black

•Excellent Optical Properties: Low Gloss, Light Shielding

•Excellent Mechanical, Electrical Properties and

Dimensional Stability

•CTE Matched with Copper Foil

•Uniform Thickness

•Coverlay, Stiffener for FPCB

•Electronic Optical Components

Insulation Tape, Label, etc.

GV
for High Temperature Insulation

•Superior Elongation and Lower Stiffener / Spring Back

•Excellent Thermal and Insulation Properties

•Coverlay, Stiffener for FPCB

High Temperature Tape & Label, etc.

GL-A for Low CTE

•Superior Dimensional Stability & Thermal Properties

•High Modulus & MD-TD Balanced Low CTE

•Superior Peel Strenth

•Defect-Free Surface

•Smooth Surface Roughness

•CoF (Chip on Film)

•Stiffener

Substrate for Flexible Solar Panel, etc.

LV-A
for Graphite sheet

•Materials for Superior Thermal Conductivity

•Cosmetic Improvement on Graphite Sheet Surface

•Minimize Loss from Shrinkage during Carbonization Process

•Various Thickness

Synthetic Graphite Sheet

PI Varnish 漿料

for Enamel

•Excellent heat stability and flexibility

•Excellent adhesion to metal wire

•Excellent corona discharge resistant

•Wire/Rod for EV, Pump, Electrical Equipment, etc.

for Semiconductor

•Superior Thermal & Flexibility

•Good Dielectric & Chemical Resistance

•Excellent Adhesion

•Passivation or Sacrificial layer
(Transistor, PN Junction, Diode,

Infrared Sensor, IC Chip, etc.)

for Display

•Dimensional Stability

•Superior Thermal & Flexibility

•Excellent Storage Stability

•TFT Substrate for Flexible OLED Display

PI Powder PI粉

PI Powder for Filler

•Superior Thermal & Dimensional Stability

•Excellent Property for Filler

•TCompound Filler, Diamond Wheel, Fiber, etc.

Direct forming mold

•Semi-finished products such as Sheet

•Mainly Used for machining customized products

•Roller, Guide Pin, Vacuum Pad, etc.

Compressing mold

•Compression molding for each application with shape

•Mainly applied to mass-produced items

•Thrust Plug/Plate, Blank, Brake Pad, Tube, etc.